Tuya AI Innovators Hackathon 2025

Overview

This hackathon, "Build AI Hardware, As Easy As Stacking Blocks," challenges you to create the next generation of AI-powered smart hardware using the Tuya Open Platform and AWS Kiro. You can focus on AI Agent Applications, Hardware Development with Tuya boards, or Industry Solutions. The event aims to empower global developers to drive innovation at the intersection of AI and IoT.

Requirements

Participants must be of legal age in their country and can join from anywhere globally. Projects must be developed based on the TuyaOpen Platform AI Open-Source Package. Preliminary submissions require a Project Introduction PDF, a DEMO video, a GitHub link (if available), and a Hardware List/Architecture Diagram. Final submissions include project code, technical documentation, and a 1-3 minute demo video. Some track-specific hardware might be needed for the Hardware Development track.

Prizes

The hackathon offers over $1,353,897 in prizes. The Grand Prize includes $2,000 cash, an Amazon Gift Card, and incubation support. Other prizes include the Best AI Hardware Design Award ($1,000 cash + gift card), Best Use of TuyaOpen ($497 cash + gift card), Best AI Coding Excellence ($200 cash), and Community Favorite Awards ($100 cash). There's also a special Kiro "Million Bonus Pool Program" for developers in Mainland China totaling $150,000 cash. Overseas developers using Vibe Coding can receive a tool purchase subsidy.